Tuesday / November 18, 2014 / 5:30 PM - 7:00 PM
Building Envelope Energy Performance: The Real Impact of Thermal Bridging
Skidmore, Owings & Merrill LLP, 224 South Michigan Avenue, 5th floor meeting room
This presentation will provide an overview of the Building Envelope Thermal Bridging Guide, with specific attention on how thermal bridging at interface details impacts building envelope performance. Typical and best practice examples for building envelope assemblies will be examined, and their impact will be assessed in the context of effective R-values and whole building energy performance. Our speakers will showcase highly visual tools that consolidate vast amounts of data into a package that allows architects and designers to make informed decisions throughout design without relying solely on, or waiting for, project specific calculations. The case studies in the presentation will examine typical construction assemblies and practices for different building types and the ability of certain projects to pass the energy code, achieve LEED certification or demonstrate annual energy cost savings based on the true performance of building envelope assemblies. This presentation shares experiences and lessons from practitioners working in cold climates in Canada and the USA and have been involved with helping designers respond to increasingly more stringent energy codes.
Speakers
Christian Cianfrone, PE, LEED AP BD+C, BEMP, is a Principal and Building Energy Specialist at Morrison Hershfield in Vancouver
Stéphane Hoffman, Vice President and Senior Building Science Specialist at Morrison Hershfield in Seattle
Marina Horchin, LEED AP BD+C, EIT, Energy and Sustainability Consulting Engineer at Environmental Systems Design (ESD) in Chicago
